High Heat Resistance：Performs reliably in high-temperature applications such as heat-resistant wires, heating elements, and satellite thermal control films.
Excellent Electrical Performance：Well suited for TAB, COF, FPC, and printed circuit boards, ensuring stable insulation and signal performance.
Strong Mechanical Support：Provides good strength and rigidity for FPC stiffeners, metallic substrates, and heavy electrical machinery.
Wide Application Compatibility：Applicable to electronics, solar cells, speaker diaphragms, and office automation equipment, offering broad industrial versatility.
Applications of 3,3′,4,4′-Biphenyltetracarboxylic Dianhydride
Used in tape automated bonding (TAB), chip-on-film (COF), lead lock tapes, and high-density flexible printed circuits (FPC), including FPC stiffeners. It is also applied in office automation equipment, flexible solar cells, speaker diaphragms for mobile phones, plasma TVs, and automotive audio systems, as well as in heavy electrical machinery. Additional applications include satellite thermal control films, printed circuit boards, metal substrates, sheet-type heating elements, and heat-resistant wires.
| English Name | 3,3′,4,4′-Biphenyltetracarboxylic dianhydride |
| English Synonyms | 3,3′,4,4′-Biphenyl tetracarboxylic diandhydride;[1,1′-Biphenyl]-3,3′,4,4′-tetracarboxylic3,4:3′,4′-dianhydride; 3,4,3′,4′-Biphenyltetracarboxylic acid dianhydride;3,3′,4,4′-Biphenyltetracarboxylic dianhydride 97%6;4,4′-Bip hthalic Anhydride (purified by sublimation);3,3’4,4′-Biphenyl tetracarboxylic acid dianhydride(s-BPDA);S-BD PA;S-BPDA |
| CAS Number | 2420-87-3 |
| Molecular Formula | C16H606 |
| Molecular Weight | 294.22 |
| EINECS Number | 219-342-9 |
| Melting point | 299-305 °C (lit.) |
| Boiling point | 614.9±48.0 °C(Predicted) |
| Density | 1.625±0.06 g/cm3(Predicted) |
| Vapor pressure | OPa at 20℃ |
| Storage conditions | Inert atmosphere,Room Temperature |
| Solubility | Almost transparent in hot DMF |
| Form | Powder crystals |
| Color | Off-white |
| Maximum wavelength (λmax) | 300nm(lit.) |
| InChI | InChI=1S/C16H6O6/c17-13-9-3-1-7(5-11(9)15(19)21-13)8-2-4-10-12(6-8)16(20)22-14(10)18/h1-6H |
| InChIKey | WKDNYTOXBCRNPV-UHFFFAOYSA-N |
| Smiles | C1(=O)C2=C(C=C(C3C=CC4C(=O)OC(=O)C=4C=3)C=C2)C(=0)01 |
| LogP | 3.91 |
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